QC Profile


1. Product Design


Hardware Design: Our hardware engineer leader Tony Che has rich experience since 2002, he is one of the pioneer GPS tracker hardware and eBike electric parts engineers in mainland China. Thanks to the past 17 years rich and dedicated GPS tracker design experiences, our hardware engineer team has achieved the ability to make excellent designs to avoid common concerns like PCB short circuit, components burning, signal interference, power supply fluctuation, etc. Additionally, based on the many years of using and device performance observation, our hardware team is very familiar with the GPS tracker components, this ability enables us to select the most suitable, original, famous brand and verified components. For example, our PCB is fireproof, can sustain high temperature up to 300-500 degree.

Firmware Design: The software team leader Sunny Xiao is a computer master graduated from the famous ZhongShan university. Since 2003 he has focused on the GPS tracker firmware and eBike display firmware and eBike controller firmware for more than 15 years. Thanks to the past experiences involved in different GPS tracker models and projects, especially the experience of China national standard project organized by China transportation department, our software team has achieved the ability to design excellent firmware structure, effectively avoid common concerns such as firmware lost, firmware dead, flash error and features conflict, etc.


2. Incoming Materials Inspection


The GPS tracker is made up of about 300 components. Some core components like GSM module, GPS module, MCU are produced by robot and from big brand company, quality control is very good, the inspection percent is lower. Some components like wires, are mainly produced by hands, the inspection percent is higher. Specific main components inspection requirements are below depends on different type materials. 

3. SMT Production


Step 1: Materials and BOM list checking. IQC check whether material’s model , specs and quantity meet the BOM (Bill of Material) sheet or not

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Step 2: Electronic materials baking. Material like PCB, IC and module, need put inside oven to remove the possibility of damp. SMT production quality is obviously affected by damped materials.

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Step 7: AOI Finished Product Inspection. After reflow soldering, use AOI machine to inspect the appearance, whether has such problem- missing solder, insufficient solder or cold solder.

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Step 8: Hand Soldering. Some components can’t sustain high temperature, these need to be welded by soldering iron, like antenna connector, electrolytic capacitor, cable connector, etc.

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Step 3: Solder Paste Printing. The temperature of solder paste is one of most important factors for faulty soldering. The solder paste has to store inside refrigerator, it require to unfreeze for at least 2 hours, then use mixer to mix for 3-5 minutes before printing.

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Step 4: SMT Patch. The patch program is set by machine

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Step 5: PCBA Inspection. After SMT patch, QC inspects the material and the patch position is correct or not, this is one of checkpoints.


Step 6: Reflow Soldering. The material on PCB after SMT machine is not firm. After reflow soldering, the material will be fixed.


Step 7: Connect external power supply, make sure the red power light on PCB on

Step 8: test each checkpoint voltage, total 9 checkpoints. Make sure SIM card is detected, GPS, GSM, MCU working well, the external power and current value are normal.

Step 9: 36V aging testing for 4 hours.

Flash testing during aging testing.

Erase, read and write flash for 500 times


Step 18: Packing